The manufacturing process of SMT surface mount processing is very complex, and each process is linked one by one. Any problem in any process will affect the quality of the product. In order to improve the soldering quality of PCBA processing for products, it is necessary to set up professional testing equipment at each process and strictly control the quality of the process.

What are the testing equipment for SMT surface mount processing?

1. SPI detection SPI, also known as solder paste thickness gauge, is generally placed after the solder paste printing process. It is mainly used to detect the distribution of solder paste thickness, area, and volume on PCB boards, and is an important equipment for monitoring the quality of solder paste printing.

2. AOI detection is an automatic optical inspection instrument that can be placed at various positions on the production line. However, it is generally placed after the reflow soldering process to inspect the soldering quality of the PCB board after reflow soldering, and to promptly detect defects such as insufficient tin, insufficient material, virtual soldering, and solder joints.

Explain the importance of AOI testing equipment for SMT surface mount processing:

When performing automatic inspection, the machine automatically scans the PCB through a camera, collects images, compares the tested solder joints with qualified parameters in the database, processes the images, checks for defects on the PCB, and displays/marks the defects through a display or automatic marker for SMT process engineers to improve and SMT maintenance personnel to repair. Automatic optical inspection equipment is widely used in SMT surface mount factories today, and there is a trend towards gradually replacing manual inspection.

3. X-RAY detection refers to the X-ray commonly used in hospitals, which uses high voltage to impact the target material to generate X-ray penetration to detect the internal structural quality of electronic components, semiconductor packaging products, and the welding quality of various types of solder joints in SMT. It is mainly used to detect BGA chips with pins located below, and can detect defects such as bridging, voids, oversized solder joints, and undersized solder joints on BGA. Some objects that are not visible on the surface can be detected using X-ray. Generally, the price is relatively expensive and it is less commonly used in small and medium-sized enterprises.