138 2887 5692 / Mr.Guo
We have successively passed QS9000, ISO9001:2000, ISO14001:2004 and UL certifications, and implemented a 3TTQC system internally (technical system, training system, quality system, customer system) to enable the company to have fast manufacturing capabilities, provide qualified and reliable products, deliver on time, competitive prices and complete customer service, and truly meet customer needs.
The introduction of new products is organized by the engineering department, with personnel from the production department, procurement department, and quality department holding a new product introduction meeting to ensure that the project is delivered with quality and quantity guaranteed.
Check the customer supplied PCB files, drawings, and coordinates, verify the BOM list, optimize material descriptions, verify models, packaging, quantities, and part numbers, and improve brand specifications and part number information.
Develop new material/process/design operation requirements, review and confirm data documents, ensure that material and PCB specifications meet the requirements for machine operation, and meet the requirements for material baking conditions.
Implement new material sample management to ensure that the quality of material samples meets product requirements and serves as the basis for procurement, ordering, and incoming inspection.
Inspect raw materials to ensure product quality, measure resistance and capacitance values based on BOM list, screen print A-class materials, check the compatibility between components and PADs, inspect pins for deformation and oxidation, and PCB appearance.
Newly opened steel mesh, testing fixtures, wave soldering fixtures, and plate splitting fixtures shall be provided with drawing specifications by the engineering department, and the process material requirements shall be indicated.
9-channel furnace temperature testing instrument combined with PCBA physical board to test actual welding temperature, 260C<10S, 235 degrees Celsius 60-90 seconds.
By integrating BOM tables, coordinates, and high-definition scanned first article images, an automatic detection program is generated to quickly and accurately detect components, automatically determine results, generate first article reports, and enhance quality control.
Fully automated process inspection first piece inspection instrument, SPI solder paste inspection instrument, 100% AOI inspection, BGA device Ray inspection.