Standardization of Manufacturing Technology
Over 3000 product introductions and process improvements
138 2887 5692 / Mr.Guo
| Layer | 2-40 layer |
|---|---|
| Materlal | FR4,high-TG，metal base，high frequency，halogen-free |
| Board thickness | 0.15mm-8.0mm |
| Max Panel size | 600*1200mm |
| Min line/space | 3/3mil |
| Min hole | Laser drilling 3mil,mechanical 0.2mm |
| Max asoect ratio | 12:1 |
| Copper thickness | 1/3 OZ to 20 OZ |
| Min BGA PAD | 0.2mm |
| HDI | 1+N+1,2+N+2, 3+N+3 |
| Pedance control | Up to +/-8% |
| VIA in pad | yes |
| Pluging resin in hole | yes |
| Half PTH hole | yes |
| Back drilling | yes |
| Carbon Ink | yes |
| Peelable solder mask ink | yes |
| Metal base | AL base,copper base,up to 4layer |
| Gold finger | Yes,Up to 60u" |
| Plating gold | Yes,Up to 400u" |
| Surface | OSP,HAL-leadfree,ENG,Sliver,immersion tin |
| Category | Process Capability | Category | Process Capability |
|---|---|---|---|
| Production Type | Single and double-sided board, multi-layer board, hollow board, layered board, soft hard bonding board, HDI buried hole board | Number of layers | 1-14 layer FPC/2-14 layer soft hard bonding board and HDI buried blind hole board |
| Maximum production size | Single and double-sided board 250 * 4000mm, multi-layer board 500 * 750mm | Insulation layer thickness | 27.5um / 50um / 75um / 100um / 125um / 150um |
| Plate thickness | FPC 0.06-0.4mm、Rigid Flex0.25-6.0mm | Surface Treatment | Sinking gold, sinking silver, gold plating, sinking tin OSP |
| Reinforcing material | FR-4 / PI / PET / SUS / PSA | Minimum line width/line spacing | 0.045mm / 0.045mm |
| Copper Foil Thickness | 12um / 18um / 35um / 70um | Minimum drilling hole | 0.1mm |