Standardization of Manufacturing Technology
Over 3000 product introductions and process improvements

Standardization of Manufacturing Technology

PCB Production Capability


Layer2-40 layer
MaterlalFR4,high-TG,metal base,high frequency,halogen-free
Board thickness0.15mm-8.0mm
Max Panel size600*1200mm
Min line/space3/3mil
Min holeLaser drilling 3mil,mechanical  0.2mm
Max asoect ratio12:1
Copper thickness1/3 OZ to 20 OZ
Min BGA PAD0.2mm
HDI1+N+1,2+N+2, 3+N+3
Pedance controlUp to +/-8%
VIA in padyes
Pluging resin in holeyes
Half PTH holeyes
Back drillingyes
Carbon Inkyes
Peelable solder mask inkyes
Metal baseAL base,copper base,up to 4layer
Gold fingerYes,Up to 60u"
Plating goldYes,Up to 400u"
SurfaceOSP,HAL-leadfree,ENG,Sliver,immersion tin



FPC Process Capability


CategoryProcess CapabilityCategoryProcess Capability
Production TypeSingle and double-sided board, multi-layer board, hollow board, layered board, soft hard bonding board, HDI buried hole boardNumber of layers1-14 layer FPC/2-14 layer soft hard bonding board and HDI buried blind hole board
Maximum production sizeSingle and double-sided board 250 * 4000mm, multi-layer board 500 * 750mmInsulation layer thickness27.5um / 50um / 75um / 100um / 125um / 150um
Plate thicknessFPC 0.06-0.4mm、Rigid Flex0.25-6.0mmSurface TreatmentSinking gold, sinking silver, gold plating, sinking tin OSP
Reinforcing materialFR-4 / PI / PET / SUS / PSAMinimum line width/line spacing0.045mm / 0.045mm
Copper Foil Thickness12um / 18um / 35um / 70umMinimum drilling hole0.1mm