The main purpose of SMT surface mount processing is to accurately install surface mounted components onto fixed positions on the PCB. However, there may be some process issues during the SMT processing that affect the quality of the surface mount, such as component displacement. The displacement of components during surface mount processing is a foreshadowing of several other issues that may arise during the soldering process of component boards, and should be taken seriously. So what are the reasons for component displacement in surface mount processing?

Reasons for component displacement in surface mount processing:

1. The usage time of solder paste is limited, and after exceeding the usage period, the flux in it deteriorates and the soldering is poor.

2. The viscosity of the solder paste itself is not sufficient, causing oscillation and shaking of the components during transportation, resulting in component displacement.

3. The solder paste contains too much flux, and excessive flux flow during reflow soldering can cause component displacement.

4. During the transportation process after printing and mounting, components may shift due to vibration or incorrect handling methods.

5. During surface mount processing, the air pressure of the suction nozzle was not adjusted properly, resulting in insufficient pressure and causing component displacement.

6. The mechanical problems of the surface mount machine itself have caused the placement of components to be incorrect.

Once component displacement occurs during surface mount processing, it will affect the performance of the circuit board. Therefore, it is necessary to understand the reasons for component displacement during the processing and provide targeted solutions.