In surface mount processing and welding technology, many customers usually have a requirement for the brightness of solder joints.In the process of surface mount processing and welding, it cannot be guaranteed that the brightness level of each welding point can meet the requirements. What is the reason for insufficient gloss of solder joints?The tin powder in the solder paste has oxidation phenomenon.Solder paste has additives in the flux itself to form extinction.In solder joint processing, the...

There are various types of PCB circuit boards, which can be classified according to board, structure, process, etc. PCB circuit boards can be divided into PCB single panel, PCB double-sided board, and PCB multi-layer board according to structure; The common multi-layer boards are four or six layer boards, and complex PCB multi-layer boards can reach more than ten layers. This article introduces several common panels through classification.1. PCB single panelPCB single panel is the most basic cir...

X-rays can penetrate different objects and be used for X-ray imaging to detect the internal conditions of different objects, but their applications are not limited to this. With the development of technology, electronic products are constantly changing, with a wide variety and fast updating speed. The size and quantity of internal components are becoming smaller and larger, which leads to SMT manufacturers being unable to accurately inventory the number of parts, affecting warehouse management a...

Typically, the copper thickness of standard PCBs ranges from 1oz to 3oz. Thick copper PCBs or thick copper PCBs are PCB types with finished copper weights exceeding 4oz (140 μ m).What is the purpose of thick copper PCB?Thick copper PCBs are widely used in power systems and power electronic devices. The additional copper weight in PCBA production allows for higher current to be conducted from the circuit board and helps with heat dissipation. The most common thick copper PCB is double-sided or mu...

Solder paste printing is a complex process in SMT surface mount processing, which can easily lead to some drawbacks and affect the quality of the final product. So to avoid frequent malfunctions during printing,1、 Pulling the tip, usually the solder paste on the solder pad will form a small hill shape after printing.Reason for occurrence: It may be caused by gaps in the scraper or excessive viscosity of the solder paste.Avoidance or solution: For SMT surface mount processing, adjust the gap betw...