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  • What is PCBA processing and what are the processing equipment?

    PCBA processing is the entire design process of PCB blank board through SMT mounting and DIP plug-in. Its processing equipment includes printing machines, dispensing machines, surface mount machines, reflow soldering machines, detection system equipment, etc. Next, we will introduce the relevant content in detail.One、 PCBA processingPCBA is the abbreviation for Printed Circuit Board+Assembly in English, which means that the entire design process of PCB blank board through SMT mounting and DIP pl...
  • IC direction confirmation and SMT speed determining factors in SMT mounting

    In addition to DIP plugins and EMS assembly, there is also SMT. Therefore, in order to enable everyone to fully familiarize themselves with and understand all the products on the website, the following will focus on the specific SMT patch, so that everyone has learning content and can achieve the above goals, rather than wasting every learning opportunity.Is the SMT SMT SMT machine available for SMT mounting?If you want to complete the SMT mounting work, you can use the SMT mounting machine, and...
  • Analysis of the reasons for component displacement in surface mount processing

    The main purpose of SMT surface mount processing is to accurately install surface mounted components onto fixed positions on the PCB. However, there may be some process issues during the SMT processing that affect the quality of the surface mount, such as component displacement. The displacement of components during surface mount processing is a foreshadowing of several other issues that may arise during the soldering process of component boards, and should be taken seriously. So what are the re...
  • A Brief Analysis of PCB Pad Design Standards for SMT Processing

    What are the design standards for PCB solder pads in surface mount processing?Below, the electronic technician will organize and introduce for you.1、 Design standards for the shape and size of PCB pads:Call the PCB standard packaging library.The minimum unilateral diameter of the solder pad shall not be less than 0.25mm, and the maximum diameter of the entire solder pad shall not exceed three times the aperture of the component.Try to ensure that the distance between the edges of the two solder ...
  • A Brief Analysis of Artificial Intelligence Promoting the Transformation of PCBA Processing Industry

    Currently, PCBA manufacturing enterprises are becoming increasingly data-driven and intelligent in all their business and production processes, from raw material procurement and manufacturing to product sales and distribution. The continuous accumulation of data and the continuous development and maturity of data algorithms and models provide opportunities for the integration of artificial intelligence into the manufacturing industry, thereby promoting the transformation of enterprises from trad...